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首页> 外文期刊>Materials Science and Engineering >Evolution of bonding interface in Al/Al-Mg-Si alloy clad wire during heating at 500 ℃
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Evolution of bonding interface in Al/Al-Mg-Si alloy clad wire during heating at 500 ℃

机译：500℃加热过程中Al / Al-Mg-Si合金包层焊合界面的演变

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摘要

Fusing of bonding interface which could lead to the combination of grains at the both sides of bonding interface, and transition of bonding interface into grain boundary occurred during heating. Both they could strengthen interface bonding, and interface bonding strength was more than doubled after heating for 6 h.
机译：结合界面的熔融会导致结合界面两侧的晶粒结合，并且在加热过程中会发生结合界面向晶界的转变。它们都可以增强界面粘合，并且加热6小时后界面粘合强度增加了一倍以上。

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  • 来源
    《Materials Science and Engineering》 |2017年第2期|538-542|共5页
  • 作者

    Xiang Wang; Ren-Guo Guan; Ying-Qiu Shang; Wei Wang; Ning Wang;

  • 作者单位

    School of Materials Science and Engineering, Northeastern University, Shenyang 110819, China;

    School of Materials Science and Engineering, Northeastern University, Shenyang 110819, China,Key Laboratory of Electromagnetic Processing of Materials, Ministry of Education, Northeastern University, Shenyang 110819, China;

    School of Materials Science and Engineering, Northeastern University, Shenyang 110819, China;

    School of Materials Science and Engineering, Northeastern University, Shenyang 110819, China;

    School of Materials Science and Engineering, Northeastern University, Shenyang 110819, China;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Heating; Interfaces; Grain boundaries; Fracture; Interface bonding strength;

    机译：加热;接口;晶界断裂;界面结合强度;

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