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首页> 外文期刊>Materials Science and Engineering >Homogenization stage during TLP bonding of RAFM steel with a Fe-Si-B interlayer: Microstructure evolution and mechanical properties
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Homogenization stage during TLP bonding of RAFM steel with a Fe-Si-B interlayer: Microstructure evolution and mechanical properties

机译:Fe-Si-B夹层的RAFM钢与TLP粘结的均质阶段:组织演变和力学性能

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摘要

In this paper, microstructure evolution and mechanical properties of transient liquid phase (TLP) bonding joints of reduced activation ferritic/martensitic (RAFM) steel using Fe-Si-B amorphous foil during homogenization stage were investigated. The results show that, numbers of block-like M_(23)C_6 carbides and ~500 nm-size elliptical Fe_2B phase are precipitated in the isothermal solidification zone (ISZ), while the larger-size rod-like Cr_2B phase with size of ~3 μm is distributed in the diffusion affected zone (DAZ). When the homogenization time extends to 30 min, the amount of Cr_2B phase reduces dramatically in the DAZ due to the interdiffusion of the alloying elements. The distribution of Cr atoms along the bonding joint was estimated through a model. The model indicates that the dissolution of the Cr_2B phase works dynamically during the homogenization stage. The maximum shear strength was obtained about 558 MPa for bonding 30 min. With extending the homogenization time, the fracture transitions from brittle mode to ductile mode. The precipitation of coarse Cr_2B phase is the main factor of the shear failure for short homogenization time. Hence, the bonding quality is able to be significantly improved with adjusting the geometric characteristics of such Cr_2B via changing the homogenization time rationally.
机译:本文研究了Fe-Si-B非晶态箔在均质阶段还原活化的铁素体/马氏体(RAFM)钢的过渡液相(TLP)键合接头的组织演变和力学性能。结果表明,在等温凝固区(ISZ)析出了块状M_(23)C_6碳化物和约500nm尺寸的椭圆形Fe_2B相,而较大尺寸的棒状Cr_2B相的析出度为〜。 3μm分布在扩散影响区(DAZ)中。当均质时间延长至30分钟时,由于合金元素的相互扩散,DAZ中Cr_2B相的含量急剧下降。通过模型估算了Cr原子沿结合点的分布。该模型表明Cr_2B相的溶解在均质化阶段动态地进行。对于30分钟的粘结,获得了约558MPa的最大剪切强度。随着均质时间的延长,裂缝从脆性模式过渡到延性模式。 Cr_2B粗大相的析出是短均质时间下剪切破坏的主要因素。因此,通过合理地改变均质化时间,通过调整这种Cr_2B的几何特性,能够显着提高接合质量。

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