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Dislocation structure evolution under electroplastic effect

机译:塑性作用下位错结构的演变

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In this study, the effect of high current density electropulsing (10(3) A/mm(2) for 150 mu s) on the residual stress of quenched steel was investigated with the objective of determining the electroplastic effect on plastic strain and dislocation evolution. The residual stress and dislocation density, which were closely related to the plastic strain, were significantly reduced through electropulsing. The direct effect of drift electrons on the dislocation motion, instead of side effects such as skin, pinch, instantaneous thermal expansion stress, and Joule heating, primarily contributes to the plastic strain. Employing the thermally activated plastic flow concept, the drift electrons were also found to have an effect on the thermally activated dislocation motion in addition to the force exerted on the dislocations by an electron wind. Under the action of drift electrons, the movement of vacancies and dislocations were enhanced, which accelerated the dislocation annihilation. In contrast, affected by the electron wind force, Frank-Read source failed to produce a large amount of dislocations, thereby simultaneously decreasing the dislocation multiplication rate. Finally, the dislocation density decreased and the dislocation structure was rearranged parallel to the direction of motion of the drift electrons.
机译:在这项研究中,研究了高电流密度电脉冲(10(3)A / mm(2)持续150μs)对淬火钢残余应力的影响,目的是确定对塑性应变和位错演化的电塑性效应。与塑性应变密切相关的残余应力和位错密度通过电脉冲显着降低。漂移电子对位错运动的直接影响,而不是诸如皮肤,捏,瞬时热膨胀应力和焦耳热的副作用,主要是造成塑性应变的原因。利用热活化的塑性流动概念,除了电子风施加在位错上的力之外,还发现漂移电子还对热活化的位错运动有影响。在漂移电子的作用下,空位和位错的运动增强,加速了位错的ni灭。相比之下,受电子风力的影响,Frank-Read源未能产生大量的位错,从而同时降低了位错倍增率。最终,位错密度降低,位错结构平行于漂移电子的运动方向重新排列。

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