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Preparation of fine copper powder using ascorbic acid as reducing agent and its application in MLCC

机译:抗坏血酸为还原剂的铜粉的制备及其在MLCC中的应用

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The preparation of ultrafine copper powder with chemical reduction method was investigated. Ascorbic acid was employed as reducing agent. Reaction of CuSO_4 · 5H_2O with ascorbic acid at 70℃ gives polyhedron monodispersed ultrafine copper powder. The copper powder having excellent dispersibility was prepared when the pH value was controlled at 6 with aqueous ammonia. Influences of reaction temperature on the efficiency of copper powders were also studied. TG/DTG/DTA of copper powder was discussed with thermal analyzer. As-prepared copper powder was applied in BME-MLCC. The micro-structures of end termination and interface were discussed with SEM and polarized light microscope. The copper end termination has high adhesion force, excellent solderibility behavior and resistance behavior to soldering.
机译:研究了化学还原法制备超细铜粉的方法。抗坏血酸用作还原剂。 CuSO_4·5H_2O与抗坏血酸在70℃下反应,得到多面体单分散超细铜粉。当用氨水将pH值控制在6时,制备了具有优异分散性的铜粉。还研究了反应温度对铜粉效率的影响。用热分析仪讨论了铜粉的TG / DTG / DTA。将制得的铜粉应用于BME-MLCC。用SEM和偏光显微镜讨论了端接和界面的微观结构。铜端接端子具有高粘附力,出色的可焊性和耐焊接性。

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