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Preparation of ultrafine silver powder using ascorbic acid as reducing agent and its application in MLCI

机译:抗坏血酸为还原剂制备超细银粉及其在MLCI中的应用

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The preparation of ultrafine silver powder with chemical reduction method was investigated. Ascorbic acid was employed as reducing agent. Reaction of AgNO3 with ascorbic acid gives polyhedron monodispersed ultrafine silver powder. Effect of reaction temperature on particles was studied. The average congeris sizes (D-50) reduces linearly from 3.1 mum to 1.0 mum as the reaction temperature increases from 20degreesC to 60degreesC. The silver powder having excellent dispersibility and different size was prepared through different pH value or different dosage surfactant. The TG/DTA of silver was discussed with thermal analyzer. As-prepared silver powder was applied in ferrite multi-layer chip inductor (MLCl). The silver end termination has high adhesion strength, excellent solderability and solder leaching resistance behavior. (C) 2004 Elsevier B.V. All rights reserved.
机译:研究了化学还原法制备超细银粉的方法。抗坏血酸用作还原剂。 AgNO3与抗坏血酸反应得到多面体单分散超细银粉。研究了反应温度对颗粒的影响。随着反应温度从20摄氏度增加到60摄氏度,平均会阴大小(D-50)从3.1微米线性减小到1.0微米。通过不同的pH值或不同剂量的表面活性剂可以制备出分散性好,粒径不同的银粉。用热分析仪讨论了银的TG / DTA。将制备的银粉应用于铁氧体多层片式电感器(MLCl)中。银端接端子具有高粘合强度,出色的可焊性和抗焊料浸出性能。 (C)2004 Elsevier B.V.保留所有权利。

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