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The topologies of contacting grains in two and three dimensions

机译:二维和三维接触晶粒的拓扑

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摘要

The topologies of contacting grains were investigated based on large grain datasets from 2D and 3D Monte Carlo simulation, 3D reconstruction of pure iron, and the cross sections of these 3D microstructures. In all systems, the results show the expected trends of high affinity for contact between few and many-faced or edged grains and avoidance of contact between grains in similar face or edge classes. However, this correlation appears relatively stronger in genuine 2D system than in 2D cross-sectional system and 3D system. This result indicates that the increase in dimension has dampening effect on the contact affinity of curvature-driven grain-growth structure. (C) 2016 Elsevier B.V. All rights reserved.
机译:基于来自2D和3D蒙特卡洛模拟,大尺寸纯铁的3D重构以及这些3D微结构的横截面的大晶粒数据集,研究了接触晶粒的拓扑。在所有系统中,结果显示了预期的趋势,即少数面和多面或边缘的晶粒之间的接触具有高亲和力,并且避免了相似面或边缘类别的晶粒之间的接触。但是,这种关联在真正的2D系统中似乎比在2D横截面系统和3D系统中相对更强。该结果表明,尺寸增加对曲率驱动的晶粒生长结构的接触亲和力具有抑制作用。 (C)2016 Elsevier B.V.保留所有权利。

著录项

  • 来源
    《Materials Letters》 |2016年第1期|162-165|共4页
  • 作者单位

    Univ Sci & Technol Beijing, Sch Mat Sci & Engn, Beijing 100083, Peoples R China|Liaoning Tech Univ, Sch Mat Sci & Engn, Fuxing 123099, Peoples R China;

    Univ Sci & Technol Beijing, Sch Mat Sci & Engn, Beijing 100083, Peoples R China;

    Univ Sci & Technol Beijing, Sch Mat Sci & Engn, Beijing 100083, Peoples R China|Univ Sci & Technol Beijing, Collaborat Innovat Ctr Steel Technol, Beijing 100083, Peoples R China;

    Cent Iron & Steel Res Inst, East China Branch, Beijing R&D Dept, Beijing 100081, Peoples R China;

    State Grid Smart Grid Res Inst, Inst Elect & New Mat & Microelect, Beijing 102211, Peoples R China;

    Univ Sci & Technol Beijing, Sch Mat Sci & Engn, Beijing 100083, Peoples R China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Microstructure; Topology; Contact affinity; Grain growth; Simulation and modelling; Serial sectioning;

    机译:微观结构;拓扑结构;接触亲和力;晶粒长大;模拟与建模;串行切片;

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