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Enhanced thermoelectric properties of Cu3SbSe4 by germanium doping

机译:锗掺杂提高了Cu3SbSe4的热电性能

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Ge doped Cu3SbSe4 semiconductors with Cu deficiencies were synthesized by melting and spark plasma sintering for the investigation of their thermoelectric transport properties. Ge atoms can successfully substitute Sb lattice sites, and result in lattice shrinkage with increasing Ge content. Doping with Ge not only improves the electrical conductivity but also optimizes the power factor of Cu-2.95(Sb1-xGexSe4. Ge doped specimens also reveal a competition between alloying effects and increased carrier thermal conductivity. The zT enhancement of Ge doped alloys is mainly ascribed to the enhanced power factor and the reduced lattice thermal conductivity. As a result, Cu-2.95(Sb0.96Ge0.04)Se-4 reaches a maximum zT of 0.7 at 640 K, showing an approximately 35% enhancement over the pristine Cu2.95SbSe4.
机译:通过熔化和火花等离子体烧结合成了锗掺杂的Cu缺陷的Cu3SbSe4半导体,以研究其热电传输性能。 Ge原子可以成功替代Sb晶格位点,并随着Ge含量的增加而导致晶格收缩。掺锗不仅可以提高电导率,而且可以优化Cu-2.95(Sb1-xGexSe4)的功率因数。掺锗样品还显示出合金化效应与载流子导热率之间的竞争。主要归因于掺锗合金的zT增强。结果,Cu-2.95(Sb0.96Ge0.04)Se-4在640 K时的最大zT为0.7,比原始的Cu2提高了约35%。 95SbSe4。

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