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Dielectric studies on Cd_(0.4)Zn_(0.6)Te thin films

机译:Cd_(0.4)Zn_(0.6)Te薄膜的介电研究

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摘要

The dielectric responses of Cd_(0.4)Zn_(0.6)Te thin films, deposited by the vacuum evaporation technique, were studied as a function of frequency and temperature for different substrate temperatures of the deposited films. Combined modulus and impedance plots were used to study the response of the film, which in general contains grains, grain boundaries, and the electrode/film interface as capacitive elements. The conductivity of the deposited films decreases with increase in substrate temperature. The dielectric constant varied between 15 and 6.8 for the films deposited in the range of substrate temperatures 300-473 K. The frequency analysis of the modulus and impedance studies showed the distribution of the relaxation times due to the presence of grains and grain boundaries in the films. The values of activation energies derived from the dissipation factor and modulus were found to be 0.64 and 0.61 eV, respectively for the films deposited at room temperature, which are higher than the values calculated from conductivity (0.41 eV). The deviation in these values was attributed to the energetic conditions of the grains and grain boundaries.
机译:研究了通过真空蒸发技术沉积的Cd_(0.4)Zn_(0.6)Te薄膜的介电响应随频率和温度的变化,随沉积薄膜的不同衬底温度而变化的情况。组合的模量和阻抗图用于研究薄膜的响应,该薄膜通常包含晶粒,晶界和电极/薄膜界面作为电容元件。沉积膜的电导率随着基板温度的升高而降低。在300-473 K的衬底温度下沉积的薄膜的介电常数在15至6.8之间变化。模量和阻抗研究的频率分析表明,由于晶粒中晶粒和晶界的存在,弛豫时间的分布。电影。对于在室温下沉积的膜,发现从耗散因数和模量得出的活化能值分别为0.64和0.61 eV,高于从电导率计算的值(0.41 eV)。这些值的偏差归因于晶粒和晶界的高能状态。

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