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Thermal analysis of tungsten coating on CuCrZr with different interlayers used as EAST divertor target materials

机译:具有不同夹层的CuCrZr上的钨涂层用作EAST偏滤器靶材的热分析

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摘要

Thermal analysis was carried out on 1 mm tungsten coated CuCrZr alloy heat sink using ANSYS code under the steady state heat flux of 5 MW/m~2. The effect on the stress, strain and surface temperature of using Titanium, nickel-chromium-aluminum alloys and W/Cu mixtures materials as compliant interlayers is examined and compared to the sharp interface architecture. Interlayer architectures effectively alleviated stress concentration in the interface compared to the sharp interface though surface temperature was increased slightly. W/Cu interlayer resulted in the maximum stress reduction of 23%, and surface temperature was only 11.8 ℃ higher than that of the sharp interface. Optimization of W/Cu interlayer observed that for 1 mm W coating 0.1 mm W/Cu interlayer with 25 vol.% W was the optimum interlayer, which resulted in the smallest peak stress.
机译:在5 MW / m〜2的稳态热通量下,使用ANSYS代码对1 mm镀钨的CuCrZr合金散热器进行了热分析。研究了使用钛,镍铬铝合金和钨/铜混合物材料作为顺应性中间层对应力,应变和表面温度的影响,并将其与清晰的界面结构进行了比较。尽管表面温度略有提高,但与锋利的界面相比,层间体系结构可有效减轻界面中的应力集中。 W / Cu中间层使最大应力降低了23%,表面温度仅比锋利的界面高11.8℃。 W / Cu夹层的优化发现,对于1 mm W的涂层,具有25%(体积)W的0.1 mm W / Cu夹层是最佳的夹层,这导致最小的峰值应力。

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