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Preparation of functionally graded W/Cu interlayers and brazing to CuCrZr and CFC for actively cooled flat tile divertor mock-ups

机译:用作CucrZR和CFC的功能渐进的W / Cu中间层和CFC的制备用于主动冷却的扁平瓷砖偏转器模拟

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The designed plasma facing materials for the divertor-components in ITER are up to now carbon (graphite or CFC) and tungsten. The heat flux loading can result in temperatures of up to 550°C at the interface between the plasma facing material and the CuCrZr heat sink, an operation temperature which is too high for CuCrZr. Additionally the temperature gradient and the mismatch in thermal expansion (CTE) of both parts of the divertor result in high stresses at the interface. A tungsten-copper composite material with a gradation from pure copper on the one side to pure tungsten on the opposite side is supposed to support the stress reduction. The tungsten contributes to the strength of the composite, whereas the copper provides the required thermal conductivity (TC) of at least 200 W/mK. The graded W/Cu layers were produced by the "chemical mixing" method and subsequent liquid phase sintering. Here the use of sub-μm W-particle sizes offers an opportunity to gain well dispersed W-particles with high Cu-containing composites resulting in lower CTE values and higher thermal conductivities compared to coarser W-powders. Brazing of the functionally graded W/Cu interlayers to CuCrZr and CFC materials resulted in adjoined mockups.
机译:设计的转移器组分的设计等离子体材料达到现在碳(石墨或CFC)和钨。热通量装载可导致高达550℃,在面对等离子体材料和铬锆铜散热片,这是太高铬锆铜的操作温度之间的界面的温度。另外,偏移器的两个部分的热膨胀(CTE)的温度梯度和不匹配导致界面处的高应力。假设钨 - 铜复合材料在一侧纯铜的一侧纯铜纯铜,所以应该支持压力降低。钨有助于复合材料的强度,而铜提供至少200W / mK的所需的导热率(Tc)。通过“化学混合”方法和随后的液相烧结产生梯度的W / Cu层。这里使用亚微粒粒子的使用提供了利用具有高Cu的复合材料获得良好分散的W颗粒的机会,导致与较粗的W粉末相比,导致较低的CTE值和较高的导热率。用CucrZR和CFC材料的功能渐进的W / Cu中间层钎焊导致相邻的样机。

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