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首页> 外文期刊>Materials & design >Probing InGaN immiscibility at AlGaN/InGaN heterointerface on silicon (111) through two-step capacitance-voltage and conductance-voltage profiles
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Probing InGaN immiscibility at AlGaN/InGaN heterointerface on silicon (111) through two-step capacitance-voltage and conductance-voltage profiles

机译:通过两步电容-电压和电导-电压曲线来探测硅(111)上AlGaN / InGaN异质界面处的InGaN不相容性

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摘要

Immiscibility of InGaN hinders epitaxial growth of high-quality AlGaN/InGaN heterojunction, which could have superior performances than AlGaN/GaN in view of high-speed devices. AlGaN/InGaN/GaN double heterostructures have been grown on silicon (111) substrate using plasma assisted molecular beam epitaxy. All growth conditions for each sample have been kept identical except the InGaN channel thickness. Alloy inhomogeneity has been found to occur in the InGaN channel by high resolution (HR) X-ray diffractometer (XRD) and cross-sectional HR-transmission electron microscopy (TEM). This non-uniformity of alloy causes reduced indium incorporation with a decrease of channel thickness along with a thin InN binary alloy. Capacitance-voltage (C-V) profile has revealed non-uniformity of alloy and spatial position of InN in the channel due to variation of band-offset and carrier confinement. Unconventional two-step profile has been obtained for the heterostructure. Higher capacitance at near zero bias corroborates the formation of InN at AlGaN/InGaN due to larger band offset. Conductance-voltage (G-V) profiles further validate mapping of InGaN phase separation in terms of carrier trapping. Lower effect of trapping has been identified due to low bandgap InN formation at the interface. Effect of epilayer relaxation on the phase separation has also been discussed in terms of threading dislocation and V-defects. (C) 2017 Published by Elsevier Ltd.
机译:InGaN的不混溶性阻碍了高质量AlGaN / InGaN异质结的外延生长,就高速器件而言,这可能具有优于AlGaN / GaN的性能。使用等离子体辅助分子束外延在硅(111)衬底上生长了AlGaN / InGaN / GaN双异质结构。除InGaN沟道厚度外,每个样品的所有生长条件均保持相同。通过高分辨率(HR)X射线衍射仪(XRD)和横截面HR透射电子显微镜(TEM),发现InGaN通道中发生合金不均匀。合金的这种不均匀性与稀薄的InN二元合金一起,导致铟掺入减少,沟道厚度减小。电容-电压(C-V)曲线揭示了由于带隙和载流子限制的变化,合金的不均匀性以及InN在沟道中的空间位置。已经获得了异质结构的非常规两步曲线。由于较大的带隙偏移,接近零偏压时的较高电容可确证在AlGaN / InGaN处形成InN。电导-电压(G-V)曲线进一步验证了在载流子捕获方面InGaN相分离的映射。由于在界面处形成的低带隙InN,已经确定了较低的俘获效应。还已经根据穿线位错和V形缺陷讨论了外延层弛豫对相分离的影响。 (C)2017由Elsevier Ltd.发布

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