Development of ultra-compact plastic-packaged high-isolation GaAs SPDT switch

摘要

A high-isolation switch IC with 31 dB isolation and 0.88 dB insertion loss at 1.65 GHz, sealed in a six-pin ultra-compact plastic package with approximately 1/4 of the conventional area, was developed for the first time. Analysis using electromagnetic-field simulation of the isolation characteristics between lead pins of the ultra-compact package and a new design method (which takes into account deterioration of the isolation characteristics due to the plastic molding) were used for this IC. Layout design using electromagnetic-field simulation also attempted to minimize chip size.