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首页> 外文期刊>Macromolecular Research >Morphologies and mechanical and thermal properties of highly epoxidized polysiloxane toughened epoxy resin composites
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Morphologies and mechanical and thermal properties of highly epoxidized polysiloxane toughened epoxy resin composites

机译:高度环氧化的聚硅氧烷增韧环氧树脂复合材料的形貌以及机械和热性能

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摘要

A novel highly epoxidized polysiloxane was synthesized to modify the diglycidyl ether of bisphenol-A (DGEBA). The mechanical and thermal properties as well as the morphology of the cured epoxy resins were examined by tensile testing, impact testing, fracture testing, differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and environmental scanning electron microscopy (ESEM). The chemical structure of the highly epoxidized polysiloxane (HEPSO) was confirmed by Fourier transform infrared spectroscopy (FTIR), 29Si nuclear magnetic resonance spectroscopy (29Si NMR), and gel permeation chromatography (GPC). The T g increased by approximately 8 °C after introducing HEPSO. TGA in air showed that the initial degradation temperature for 5% weight loss (T d 5%), the temperature for 50% weight loss (T d 50%) and the residual weight percent at 800 °C (R 800) were increased after introducing HEPSO. The addition of 4 phr HEPSO2 resulted in the highest increase in tensile strength, impact strength and fracture toughness (K IC ). The morphology of the fracture surfaces show that the miscibility of polysiloxane with epoxy resin increased with increasing epoxide group in HEPSO. The high epoxide groups in HEPSO can react during the curing process, and participate chemically in the crosslinking network. HEPSO is expected to improve significantly the toughness and thermal stability of epoxy resin.
机译:合成了新型的高度环氧化的聚硅氧烷,以修饰双酚A的二缩水甘油醚(DGEBA)。通过拉伸测试,冲击测试,断裂测试,差示扫描量热法(DSC),热重分析(TGA)和环境扫描电子显微镜(ESEM)来检查固化环氧树脂的机械和热性能以及形态。通过傅立叶变换红外光谱(FTIR),29 Si核磁共振光谱(29 Si NMR)和凝胶渗透色谱法(GPC)证实了高环氧化聚硅氧烷(HEPSO)的化学结构。引入HEPSO后,T g 增加了约8°C。空气中的TGA表明,初始降解温度为5%失重(T d 5%),温度为50%失重(T d 50%)和800°C时的残余重量百分比引入HEPSO后C(R 800 )增加。添加4 phr的HEPSO2可以使拉伸强度,冲击强度和断裂韧性(K IC )的增加最大。断裂表面的形态表明,聚硅氧烷与环氧树脂的混溶性随HEPSO中环氧基的增加而增加。 HEPSO中的高环氧基可以在固化过程中反应,并化学参与交联网络。预计HEPSO将显着改善环氧树脂的韧性和热稳定性。

著录项

  • 来源
    《Macromolecular Research》 |2010年第9期|p.853-861|共9页
  • 作者单位

    Key Laboratory of Polymer Materials for Electronics, Guangzhou Institute of Chemistry, Chinese Academy of Sciences, Guangzhou, 510650, China;

    Key Laboratory of Polymer Materials for Electronics, Guangzhou Institute of Chemistry, Chinese Academy of Sciences, Guangzhou, 510650, China;

    Key Laboratory of Polymer Materials for Electronics, Guangzhou Institute of Chemistry, Chinese Academy of Sciences, Guangzhou, 510650, China;

    Key Laboratory of Polymer Materials for Electronics, Guangzhou Institute of Chemistry, Chinese Academy of Sciences, Guangzhou, 510650, China;

    Key Laboratory of Polymer Materials for Electronics, Guangzhou Institute of Chemistry, Chinese Academy of Sciences, Guangzhou, 510650, China;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    epoxy; polysiloxane; hydrolysis and condensation; toughness; morphology; thermal properties;

    机译:环氧;聚硅氧烷;水解和缩合;韧性;形貌;热性能;

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