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Measurement of Adhesion Work of Electrospun Polymer Membrane by Shaft-Loaded Blister Test

机译:轴载泡罩法测量电纺聚合物膜的粘附功

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The work of adhesion at the interface of electrospun membrane and rigid substrate isnmeasured by a shaft-loaded blister test (SLBT). Poly(vinylidene fluoride) (PVDF) were electrospunnwith an average fiber diameter of 333 ± 59 nm. Commercial cardboard with inorganic coating wasnused to provide a model substrate for adhesion tests. In SLBT, the elastic response PVDF wasnanalyzed and its adhesion energy measured. The average value of the adhesion work is 206 ± 26nmJ/m2. Elastic modulus of electrospun membrane obtained by SLBT is found to be 23.42 ± 2.69nMPa, which is consistent with the value obtained from standard tensile tests. The results shownSLBT presented a viable methodology for evaluating the adhesion energy of electrospun polymernfabrics.
机译:在静电纺丝膜和刚性基材之间的界面上的粘附作用是通过轴载起泡试验(SLBT)进行测量的。电纺聚偏二氟乙烯(PVDF),平均纤维直径为333±59 nm。对具有无机涂层的商品纸板进行护理,以提供用于粘合测试的模型基材。在SLBT中,分析了弹性响应PVDF并测量了其粘合能。粘附功的平均值为206±26nmJ / m 2。发现通过SLBT获得的电纺膜的弹性模量为23.42±2.69nMPa,这与从标准拉伸试验获得的值一致。结果表明SLBT提供了一种可行的方法来评估电纺高分子织物的粘合能。

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