Study on Mechanism for Material Removal and Surface Generation by Molecular Dynamics Simulation in Abrasive Processes

摘要

Molecular dynamics method which is different to continuous linear mechanics is employed to survey the features of grinding and indentation energy dissipation, forces, stress state the atomic space, and then explain the micro-scale mechanism of material removed and surface generation. The research shows that the atoms of the lattice reconstituting and some non-crystal layer are pilled up on the front of abrasive grain, as a result of the continuous advancement of the abrasive grain; the material is removed and formed the grinding chips. The degenerating layer of machined surface is formed with the reconstituting of non-crystal atoms and fracture atomic bonds; it consists of outer non-crystal and inner lattice deformation layers.