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Method for manufacturing nanoscale structures in transition metal layers

机译:在过渡金属层中制造纳米级结构的方法

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摘要

In most transition metals, steeply profiled nanoscale structures can not easily be obtained by dry etching, due to the redeposition of the etch products. An alternative method is presented here, which comprises the deposition of a plating base, electron-beam writing of nanoscale structures in negative tone hydrogen silsesquioxane resist, and electroplating of the desired metal layer between the resist lines. This method is used for making transmittive and reflective masks, alignment marks, and other optical gratings, consisting of features down to 40 nm wide that are embedded in transition metal layers. These gratings can, e.g., be applied in extreme-UV lithographic sensors. More generally, other devices, e.g., magnetic recording heads, can also be manufactured using this technology.
机译:在大多数过渡金属中,由于蚀刻产物的再沉积,很难通过干法蚀刻获得陡峭轮廓的纳米级结构。在此提出了一种替代方法,该方法包括沉积镀层,在负型倍半硅氧烷氢抗蚀剂中对纳米级结构进行电子束写入,以及在抗蚀剂线之间电镀所需的金属层。此方法用于制作透射和反射掩模,对准标记和其他光栅,这些光栅由嵌入过渡金属层的宽度低至40 nm的特征组成。这些光栅可以例如应用于极端UV光刻传感器中。更一般而言,也可以使用该技术来制造其他设备,例如磁记录头。

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