首页> 外文期刊>Journal of Vacuum Science & Technology. B, Microelectronics and Nanometer Structures >Effects of flare in extreme ultraviolet lithography: Learning from the engineering test stand
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Effects of flare in extreme ultraviolet lithography: Learning from the engineering test stand

机译:耀斑在极紫外光刻中的影响:向工程测试台学习

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摘要

One of the technical challenges for introducing extreme ultraviolet lithography (13.5 nm) into high volume manufacturing is flare. Flare reduces aerial image contrast and creates critical dimension (CD) variations across the die due to local chrome density dependent flare variations. Therefore, it is important to experimentally characterize flare on a full-field stepper and develop methods to mitigate and compensate for its effects. In this article, the impact of flare on depth of focus and exposure latitude are experimentally quantified using the engineering test stand. In addition, we report a marked increase in line width roughness due to high levels of flare in the optical system. A technique for the extraction of the point spread function due to scatter using density dependent CD data has been demonstrated for more accurate flare variation compensation.
机译:将极紫外光刻技术(13.5 nm)引入批量生产的技术挑战之一是光斑。耀斑降低了航空图像的对比度,并由于局部铬密度相关的耀斑变化而在整个芯片上产生了临界尺寸(CD)变化。因此,重要的是对全场步进器上的耀斑进行实验表征,并开发减轻和补偿其影响的方法。在本文中,耀斑对聚焦深度和曝光纬度的影响使用工程测试台通过实验进行了量化。此外,由于光学系统中的高光斑,我们报告线宽粗糙度明显增加。已经证明了使用密度依赖的CD数据提取由于散射而导致的点扩散函数的技术,可实现更精确的耀斑变化补偿。

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