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Trend and Challenge on System-on-a-Chip Designs

机译:片上系统设计的趋势和挑战

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摘要

The success of system-on-a-chip (SoC) hinges upon a well-concerted integrated approach from multiple disciplines, such as device, design, and application. From the device perspective, rapidly improving VLSI technology allows the integration of billions of transistors on a single chip, thus permitting a wide range of functions to be combined on one chip. From the application perspective, numerous killer applications have been identified, which can make full use of the aforementioned functionalities provided by a single chip. From the design perspective, however, with greater device integration, system designs become more complex and are increasingly challenging to design. Moving forward, novel approaches will be needed to meet these challenges. This paper explores several new design strategies, which represent the current design trends to deal with the emerging issues. For example, recognizing the stringent requirements on power consumption, memory bandwidth/ latency, and transistor variability, novel power/thermal management, multi-processor SoC, reconfigurable logic, and design for verification and testing have now been incorporated into modern system design. In addition, we look into some plausible solutions. For example, further innovations on scalable, reusable, and reliable system architectures, IP deployment and integration, on-chip interconnects, and memory hierarchies are all anticipated in the near future.
机译:片上系统(SoC)的成功取决于来自多个领域(例如设备,设计和应用程序)的经过良好验证的集成方法。从设备的角度来看,快速改进的VLSI技术允许在单个芯片上集成数十亿个晶体管,从而可以在一个芯片上组合多种功能。从应用的角度来看,已经确定了许多杀手级应用,它们可以充分利用单个芯片提供的上述功能。但是,从设计的角度来看,随着更大的设备集成度,系统设计变得更加复杂,并且对设计的挑战也越来越大。展望未来,将需要新颖的方法来应对这些挑战。本文探索了几种新的设计策略,这些策略代表了当前设计趋势以应对新兴问题。例如,认识到对功耗,存储器带宽/延迟和晶体管可变性的严格要求,新颖的功率/热管理,多处理器SoC,可重配置逻辑以及用于验证和测试的设计现已纳入现代系统设计中。此外,我们研究了一些可行的解决方案。例如,在不久的将来,可以预期在可伸缩,可重用和可靠的系统体系结构,IP部署和集成,片上互连以及内存层次结构方面的进一步创新。

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