INTEGRATED MODELING OF MICROWAVE FOOD PROCESSING AND COMPARISON WITH EXPERIMENTAL MEASUREMENTS

摘要

This paper presents an integrated electromagnetic and thermal model for the microwave processing of food packages. The model is developed by combining the edge finite element formulation of the 3-D vector electromagnetic field in the frequency domain and the node finite element solution of the thermal conduction equation. Both mutual and one-way coupling solution algorithms are discussed. Mutual coupling entails the iterative solution of the electromagnetic field and the thermal field, because the physical properties are temperature-dependent. The one-way coupling is applicable when the properties are temperature independent or this dependence is weak. Mesh sensitivity and shape regularity for the edge element based formulation for computational electromagnetics are discussed in light of available analytical solutions for a simple wave guide. The integrated model has been used to study the electromagnetic and thermal phenomena in a pilot scale microwave applicator with and without the food package immersed in water. The calculated results are compared with the experimentally measured data for the thermal fields generated by the microwave heating occurring in a whey protein gel package, and reasonably good agreement between the two is obtained.