首页> 外文期刊>The Journal of Microwave Power & Electromangnetic Energy >2.45-GHz microwave plasma sources using solid-state microwave generators. Collisional-type plasma source
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2.45-GHz microwave plasma sources using solid-state microwave generators. Collisional-type plasma source

机译:使用固态微波发生器的2.45-GHz微波等离子体源。碰撞型等离子体源

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摘要

The availability of high power solid-state microwave generators opens new directions in plasma generation with applications in industrial plasma processing at low pressure. The optimization of the plasma production line, i.e. from the microwave generator to the plasma source, is a requisite to enable the scaling-up while ensuring a robust control of the equipment. In addition to the electron cyclotron resonance (ECR) coaxial microwave plasma source previously reported, a collisional plasma source was developed for processing at 1-100 Pa. Similar to the ECR plasma source, the results of measurements performed with the collisional plasma source demonstrate that plasma density and uniformity are highly dependent on the microwave power, the reactor pressure and the distance to and between plasma sources. It was demonstrated that the collisional plasma source can attain very high plasma densities, i.e. >10~(12) cm~(-3) in argon and >10~(11) cm~(-3) in molecular gases like O_2, N_2, air, H_2, making it suitable for high deposition rate plasma-enhanced chemical vapour deposition or for high density production of reactive species. A comparison of the two microwave plasma sources is given for the main plasma parameters; the choice of one plasma source over the other depends on the intended process/operating pressure.
机译:高功率固态微波发生器的出现为等离子体的产生开辟了新的方向,并将其应用于低压工业等离子体处理中。优化等离子体生产线,即从微波发生器到等离子体源,是实现按比例放大同时确保对设备进行可靠控制的必要条件。除了先前报道的电子回旋共振(ECR)同轴微波等离子体源之外,还开发了一种碰撞等离子体源,用于在1-100 Pa的压力下进行处理。与ECR等离子体源相似,使用碰撞等离子体源进行的测量结果表明:等离子体密度和均匀度高度依赖于微波功率,反应堆压力以及等离子体源与等离子体源之间的距离。结果表明,碰撞等离子体源可以达到很高的等离子体密度,即在氩气中> 10〜(12)cm〜(-3),在分子气体(如O_2,N_2)中> 10〜(11)cm〜(-3)。 ,空气,H_2,使其适用于高沉积速率的等离子体增强化学气相沉积或高密度反应物种的生产。比较了两个微波等离子体源的主要等离子体参数。一个等离子体源相对于另一个等离子体源的选择取决于预期的工艺/操作压力。

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