机译:考虑到大规模集成电路制造过程的顺序,可以对临界尺寸误差进行高精度校正
Nuflare Technology Inc. Marketing Department 3-2-6 Shin-Yokohama, Kohoku-ku Yokohama 222-0033, Japan;
Nuflare Technology Inc.Mask Drawing Equipment Development Department 8, Shinsugita, Isogo-ku Yokohama, Kanagawa 235-0032, Japan;
Nuflare Technology Inc.Mask Drawing Equipment Development Department 8, Shinsugita, Isogo-ku Yokohama, Kanagawa 235-0032, Japan;
Nuflare Technology Inc.Mask Drawing Equipment Development Department 8, Shinsugita, Isogo-ku Yokohama, Kanagawa 235-0032, Japan;
Nuflare Technology Inc.EB Mask Equipment Engineering Department 2068-3, Ooka, Numazu-shi Shizuoka 410-8510, Japan;
Nuflare Technology Inc.EB Mask Equipment Engineering Department 2068-3, Ooka, Numazu-shi Shizuoka 410-8510, Japan;
LSI; semiconductor; lithography; process; mask; global; CD; correction; micro; loading; flare; CMP; proximity; effect;
机译:大规模集成制造工艺中出现的关键尺寸误差的高精度校正
机译:大规模集成电路制造过程中出现的关键尺寸误差的高精度校正:基于模式的模型
机译:CASCADE:标准的超级单元设计方法,具有拥挤驱动的布局,用于三维互连的超大型集成电路
机译:三维集成电路中TSV的在线错误检测和纠正技术
机译:用于顺序三维集成电路制造的低热预算处理。
机译:用于单片三维集成电路应用的低成本和低温多晶硅纳米线传感器阵列的制造
机译:三维集成电路制造技术
机译:用于VLsI(超大规模集成)器件的集成电路制造工艺的计算机辅助设计(半导体集成电路的计算机辅助工程)。