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机译:用于1.5 Teradot / inch〜2位图案化介质的伺服集成模板的制备,采用嵌段共聚物定向组装
Media Research Center, Seagate Technology, 47010 Kato Road, Fremont, California 94538, United States;
Media Research Center, Seagate Technology, 47010 Kato Road, Fremont, California 94538, United States;
Media Research Center, Seagate Technology, 47010 Kato Road, Fremont, California 94538, United States;
Media Research Center, Seagate Technology, 47010 Kato Road, Fremont, California 94538, United States;
Media Research Center, Seagate Technology, 47010 Kato Road, Fremont, California 94538, United States;
Media Research Center, Seagate Technology, 47010 Kato Road, Fremont, California 94538, United States;
Media Research Center, Seagate Technology, 47010 Kato Road, Fremont, California 94538, United States;
Media Research Center, Seagate Technology, 47010 Kato Road, Fremont, California 94538, United States;
Media Research Center, Seagate Technology, 47010 Kato Road, Fremont, California 94538, United States;
directed self-assembly; block copolymer; imprint lithography; template fabrication; bit patterned media; magnetic recording;
机译:区域密度为1.5 Teradot / Inch2及更高的位型介质的嵌段共聚物的定向自组装
机译:区域密度为1.5 Teradot / Inch2及更高的位型介质的嵌段共聚物的定向自组装
机译:纳米压印光刻技术与嵌段共聚物定向自组装的集成,用于制造位图介质的20 nm以下模板
机译:通过结合嵌段共聚物定向自组装和纳米压印光刻技术,在圆形轨道上制作具有矩形位的模板
机译:嵌段共聚物和三元嵌段共聚物/均聚物共混物在化学图案化表面上的定向自组装成面向装置的几何形状。
机译:区域退火和图案模板法在二嵌段共聚物薄膜中定向自组装的数值模拟
机译:用于位图介质制造的嵌段共聚物的定向自组装