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TWO-DIMENSIONAL MIXED PROBLEM OF THERMOELASTICITY FOR A SEMISTRIP

机译:半带热弹性的二维混合问题

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摘要

We study the stress state of a semistrip with conditions of smooth contact imposed on one of its lateral surfaces and coupling conditions given on the other surface under the action of normal loading and temperature on the end face. The original problem is reduced to a one-dimensional vector boundary-value problem by the method of integral transformations. By using the tools of matrix differential calculus and Green matrix function, we reduce the obtained problem to a singular integral equation for the derivative of displacements on the end face of the semistrip and solve this equation by the method of orthogonal polynomials. We perform the numerical analysis of fields of displacements and stresses inside the semistrip and establish the zones of tensile stresses on the lateral face of the semistrip and the conditions of their formation.
机译:我们研究了在正常载荷和端面温度作用下,在其一个侧面上施加平滑接触条件而在另一面上给出耦合条件的半带应力状态。通过积分变换的方法将原始问题简化为一维矢量边界值问题。通过使用矩阵微积分和格林矩阵函数的工具,我们将获得的问题简化为奇异积分方程,以求解半带状结构端面上的位移导数,并通过正交多项式方法求解该方程。我们对半带状区域内的位移和应力场进行了数值分析,并在半带状区域的侧面上建立了拉应力区域及其形成条件。

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