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首页> 外文期刊>Journal of Materials Science >Contact angles by the solid-phase grain boundary wetting (coverage) in the Co–Cu system
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Contact angles by the solid-phase grain boundary wetting (coverage) in the Co–Cu system

机译:Co-Cu系统中固相晶界润湿(覆盖)的接触角

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摘要

The microstructure of binary Co–13.6 wt% Cu and Cu–4.9 wt% Co alloys after long anneals (930–2,100 h) was studied between 880 and 1,085 °C. The contact angles between (Co) particles and (Cu)/(Cu) grain boundaries (GBs) in the Cu–4.9 wt% Co alloy are between 50° and 70°. In the Co–13.6 wt% Cu alloy, the transition from incomplete to complete wetting (coverage) of (Co)/(Co) GBs by the second solid phase (Cu) has been observed. The portion of completely wetted (Co)/(Co) GBs increases with increasing temperature beginning from T wss = 970 ± 10 °C and reaches a maximum of 15% at 1,040 °C. This temperature is very close to the Curie point in the Co–Cu alloys (1,050 °C). Above 1,040 °C, the amount of completely wetted (Co)/(Co) GBs decreases with increasing temperature and reaches zero at T wsf = 1,075 ± 5 °C. Such reversible transition from incomplete to complete wetting (coverage) of a GB by a second solid phase is observed for the first time.
机译:在880至1,085°C之间进行了长时间退火(930–2,100 h)后,研究了二元Co–13.6 wt%Cu和Cu–4.9 wt%Co合金的微观结构。 Cu–4.9 wt%Co合金中(Co)颗粒与(Cu)/(Cu)晶界(GBs)之间的接触角在50°至70°之间。在Co-13.6 wt%的Cu合金中,观察到第二固相(Cu)从(Co)/(Co)GBs的不完全润湿到完全润湿(覆盖)。从T wss = 970±10°C开始,完全润湿的(Co)/(Co)GBs的部分随温度升高而增加,并在1,040°C时达到最高15%。该温度非常接近Co-Cu合金的居里点(1,050°C)。高于1,040°C,完全润湿的(Co)/(Co)GBs的数量随温度升高而降低,并在T wsf = 1,075±5°C时达到零。首次观察到第二固相从不完全到完全润湿(覆盖)GB的这种可逆转变。

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