The Formation of Liquid Metal Channels Network under Grain Boundary Wetting in the Cu-Bi System

摘要

Grain boundary liquid grooving process takes place during the contact of solid metal phase with the metal melt. The liquid bismuth network formation along grain boundaries (GB) and triple junctions (TJ) was investigated in copper polycrystalline samples. The experimental observation in situ technique of Bi penetration through the Cu plate was used. Microscopic images of the liquid channels network were obtained. The temperature dependencies of GB and TJ effective penetration depths were determined. The effect of the GB and TJ diffusion on the liquid channels growth mechanism was discussed.