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Electrical characteristics of ZrN metallised metal-oxide-semiconductor and metal-insulator-metal devices

机译:ZrN金属化金属氧化物半导体和金属绝缘体金属器件的电学特性

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摘要

The electrical properties of DC reactive sputtered zirconium-nitride metallized metal-oxide-semiconductor (MOS) and metal-insulator-metal (MIM) devices on TiO2/p-Si and TiO2/ZrN films were studied using capacitance-voltage (C-V) and current-voltage (I-V) measurements at room temperature. Capacitances of the ZrN/TiO2/p-Si MOS device were measured in accumulation mode and inversion mode, from which flat band capacitance was found to be 2.86pF, which corresponds to flat band voltage of -1.7 V. Fixed oxide charged density and interface state density was found to be 1.63x 10(10) cm(-2) and 6.3x 10(11) cm(-2) eV(-1). I-V characteristics revealed that the leakage current density was of 0.5 mA/cm(2) in accumulation mode and 2 mA/cm(2) in inversion mode at a field of 0.12 MV/cm, respectively. Dielectric breakdown of ZrN/TiO2/p-Si device was found to be 0.12 MV/cm in accumulation mode. Based on the C-V and I-V characteristics, the ZrN/TiO2/ZrN structure showed no variation in the capacitance value as the bias voltage was changed.
机译:利用电容电压(CV)和电容电压(CV)研究了DC反应溅射氮化锆金属化金属氧化物半导体(MOS)和金属绝缘金属(MIM)器件的电学性能。室温下的电流-电压(IV)测量。在累积模式和反转模式下测量ZrN / TiO2 / p-Si MOS器件的电容,发现扁平带电容为2.86pF,对应于-1.7 V的扁平带电压。固定的氧化物电荷密度和界面发现状态密度为1.63x 10(10)cm(-2)和6.3x 10(11)cm(-2)eV(-1)。 I-V特性显示,在累积模式下,在0.12 MV / cm的电场下,泄漏电流密度分别为0.5 mA / cm(2)和在反转模式下为2 mA / cm(2)。发现ZrN / TiO2 / p-Si器件的介电击穿在累积模式下为0.12 MV / cm。基于C-V和I-V特性,随着偏置电压的变化,ZrN / TiO2 / ZrN结构的电容值没有变化。

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