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Effect of multi-walled carbon nanotube (MWCNT) concentration on thermomechanical reliability of MWCNT-reinforced solderable isotropic polymer nanocomposites

机译:多壁碳纳米管(MWCNT)浓度对MWCNT增强的可焊各向同性聚合物纳米复合材料热机械可靠性的影响

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摘要

Multi-walled carbon nanotube (MWCNT)-rein-forced solderable isotropic polymer nanocomposites (SIPNs) containing low-melting-point alloys (LMPAs) were developed to enhance the interconnection properties of solderable isotropic polymer composites (SIPCs). In this study, the reliability properties of MWCNT-reinforced SIPN assemblies with different MWCNT concentrations were investigated through thermal shock (-55-125 ℃, 1000 cycles) and high-temperature and high-humidity (85 ℃, 85 %RH, 1000 h) tests. In addition, the interfacial microstructure and fracture mode of the MWCNT-reinforced SIPN joint were investigated. All the MWCNT-reinforced SIPN assemblies, with different MWCNT concentrations, showed stable electrical reliability during reliability tests owing to the formation of a metallurgical interconnection between the corresponding metallization layers by molten LMPA fillers. The mechanical reliability properties of all the MWCNT-reinforced SIPN assemblies degraded owing to excessive intermetallic compound (IMC) layer growth. However, the mechanical reliability properties of MWCNT-reinforced SIPNs with a low MWCNT concentration (<1 wt%) were superior to those of the SIPNs without MWCNTs owing to the initial high bonding strength of the former due to the reinforcing effect of MWCNTs.
机译:开发了包含低熔点合金(LMPA)的多壁碳纳米管(MWCNT)增强型可焊各向同性聚合物纳米复合材料(SIPN),以增强可焊各向同性聚合物复合材料(SIPC)的互连性能。通过热冲击(-55-125℃,1000次循环)和高温高湿(85℃,85%RH,1000 h)研究了不同MWCNT浓度的MWCNT增强SIPN组件的可靠性。 )测试。此外,还研究了MWCNT增强的SIPN接头的界面微观结构和断裂模式。所有具有不同MWCNT浓度的MWCNT增强的SIPN组件,由于在相应的金属化层之间通过熔融LMPA填料形成了冶金互连,因此在可靠性测试期间显示出稳定的电气可靠性。由于过多的金属间化合物(IMC)层的生长,所有MWCNT增强的SIPN组件的机械可靠性性能都下降了。然而,由于MWCNTs的增强作用,前者最初具有较高的结合强度,因此具有低MWCNT浓度(<1 wt%)的MWCNT增强的SIPNs的机械可靠性性能优于不具有MWCNTs的SIPNs。

著录项

  • 来源
    《Journal of materials science》 |2016年第9期|9159-9171|共13页
  • 作者

    Byung-Seung Yim; Jong-Min Kim;

  • 作者单位

    School of Mechanical Engineering, Chung-Ang University, Seoul 156-756, South Korea;

    School of Mechanical Engineering, Chung-Ang University, Seoul 156-756, South Korea;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
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