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The effect of substrate temperature, Cu/Sn ratio and post-annealing on the phase-change and properties of Cu_2SnS_3 film deposited by ultrasonic spray pyrolysis

机译:衬底温度,Cu / Sn比和后退火对超声喷雾热解沉积Cu_2SnS_3薄膜相变和性能的影响

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摘要

In this work, Cu_2SnS_3 (CTS) films were prepared by a simple ultrasonic spray pyrolysis method on soda-lime glass substrates with different Cu/Sn precursor ratio and substrate temperature. The structural, component, morphological, optical and electrical properties of the films were investigated. XRD and Raman results confirmed that the Cu_2SnS_3 films were polymorphism with tetragonal phase and monoclinic phase. Sn-rich precursor and higher substrate temperature may change the dominant phase from tetragonal CTS phase to monoclinic CTS phase. Optical band gap of the films decreased from 1.87 to 1.03 eV with increasing Cu/Sn precursor ratio under 350 ℃. All the films showed p-type conductivity with a minimum resistivity of 3.5 × 10~(-3) Ω cm. Additionally, the CTS films were annealed at 500 ℃ in sulfur atmosphere to improve the crystallinity and sulfur content. After annealing, a narrow band gap and pure CTS film was obtained, which could be a promising absorber layer material for high efficiency solar cell.
机译:在这项工作中,通过简单的超声喷雾热解方法在具有不同Cu / Sn前驱体比率和衬底温度的钠钙玻璃衬底上制备了Cu_2SnS_3(CTS)膜。研究了薄膜的结构,成分,形态,光学和电学性质。 XRD和Raman结果证实Cu_2SnS_3薄膜具有四方相和单斜相多态性。富锡前驱物和较高的基板温度可能会将主导相从四方CTS相变为单斜CTS相。在350℃下,随着Cu / Sn前驱体比的增加,薄膜的带隙从1.87 eV下降到1.03 eV。所有薄膜均显示p型导电性,最小电阻率为3.5×10〜(-3)Ωcm。此外,将CTS薄膜在硫气氛中于500℃退火,以提高结晶度和硫含量。退火后,获得了窄的带隙和纯的CTS膜,这可能是用于高效太阳能电池的有希望的吸收层材料。

著录项

  • 来源
    《Journal of materials science》 |2016年第5期|4636-4646|共11页
  • 作者单位

    Key Laboratory of Polar Materials and Devices, Ministry of Education, Department of Electronic Engineering, East China Normal University, 500 DongChuan Road, Shanghai 200241, China;

    Department of Physics, East China Normal University, 500 DongChuan Road, Shanghai 200241, China;

    Key Laboratory of Polar Materials and Devices, Ministry of Education, Department of Electronic Engineering, East China Normal University, 500 DongChuan Road, Shanghai 200241, China;

    Key Laboratory of Polar Materials and Devices, Ministry of Education, Department of Electronic Engineering, East China Normal University, 500 DongChuan Road, Shanghai 200241, China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
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