...
机译:在临界回流温度下,尺寸对板级混合BGA互连中Sn-ball / Sn3.0Ag0.5Cu-膏/ Cu接头的界面反应和微观结构演变的影响
School of Materials Science and Engineering, South China University of Technology,Guangdong Provincial Engineering R&D Center of Electronic Packaging Materials and Reliability, South China University of Technology;
School of Materials Science and Engineering, South China University of Technology;
School of Materials Science and Engineering, South China University of Technology,Guangdong Provincial Engineering R&D Center of Electronic Packaging Materials and Reliability, South China University of Technology;
School of Materials Science and Engineering, South China University of Technology,Guangdong Provincial Engineering R&D Center of Electronic Packaging Materials and Reliability, South China University of Technology;
机译:低温焊接SN-AG-CU / SN-Bi-X混合BGA焊点用于消费电子产品的板级降低性和断裂行为
机译:SN-BALL / SN-3.0AG-0.5CU - 糊/ Cu关节回流焊接期间的熔化特性和界面反应
机译:Sn-9Zn焊料在Cu或Au / Ni / Cu BGA电解基板上的界面反应和接头可靠性
机译:尺寸对BGA封装倒装芯片中Cu / Sn3.0Ag0.5Cu球/Sn3.0Ag0.5Cu膏/ Cu接头的界面反应和微观结构演变的影响
机译:界面反应对3003 Al / T2 Cu和1035 Al / T2 Cu钎焊关节的微观结构和力学性能的影响