首页> 外文期刊>Journal of materials science >Impact of molarity on structural, optical, morphological and electrical properties of copper oxide thin films prepared by cost effective jet nebulizer spray pyrolysis technique
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Impact of molarity on structural, optical, morphological and electrical properties of copper oxide thin films prepared by cost effective jet nebulizer spray pyrolysis technique

机译:摩尔浓度对经济高效的喷射雾化器喷雾热解技术制备的氧化铜薄膜的结构,光学,形态和电学性质的影响

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摘要

Copper oxide (CuO) thin films were prepared by simple and cost effective jet nebulizer spray pyrolysis method with different molar concentration 0.1, 0.2 and 0.3M named as J1, J2 and J3 respectively. The impact of molarity on structural, optical, morphological and electrical of properties of CuO thin film was studied. The structural studies confirmed that the prepared CuO thin films are monoclinic crystal structure matching with standard JCPDS card No. 89-5899. The thickness of CuO thin films determined by surface profilometer found to be increasing while increasing molar concentration. The optical energy band gaps were determined using Kulbelka-Munk (K-M) method are found to be 2.1eV, 1.9eV and 1.8eV for J1, J2 and J3 respectively. The morphological properties and chemical composition of CuO thin film were investigated via field-emission scanning electron microscope (FESEM) and energy dispersive analysis from X-ray spectroscopy (EDAX). According to FESEM all the prepared CuO thin films are well covered and adhered to the substrate with good homogeneity and EDAX spectra confirms the presence of copper (Cu) and oxygen (O). The adhesion strength has been determined in accordance with test method D3330 using scotch tape test. The electrical conductivity of CuO thin films were investigated. The maximum conductivity value of the CuO thin film is observed 2.75x10(-8)S/cm.
机译:采用简单高效的喷射雾化器喷雾热解法制备了氧化铜(CuO)薄膜,摩尔浓度分别为0.1、0.2和0.3M,分别命名为J1,J2和J3。研究了摩尔浓度对CuO薄膜结构,光学,形貌和电学性质的影响。结构研究证实,所制备的CuO薄膜是单斜晶体结构,与标准JCPDS卡号89-5899相匹配。发现通过表面轮廓仪测定的CuO薄膜的厚度随着摩尔浓度的增加而增加。使用Kulbelka-Munk(K-M)方法确定的光能带隙对J1,J2和J3分别为2.1eV,1.9eV和1.8eV。通过场发射扫描电子显微镜(FESEM)和X射线能谱(EDAX)的能量色散分析研究了CuO薄膜的形貌和化学组成。根据FESEM,所有制备的CuO薄膜均被良好地覆盖,并以良好的均匀性粘附在基材上,EDAX光谱证实了铜(Cu)和氧(O)的存在。粘合强度已经根据测试方法D3330使用透明胶带测试来确定。研究了CuO薄膜的电导率。观察到CuO薄膜的最大电导率值为2.75×10(-8)S / cm。

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  • 来源
    《Journal of materials science》 |2019年第2期|1571-1578|共8页
  • 作者单位

    PSG Coll Arts & Sci, Dept Elect, Coimbatore 641014, Tamil Nadu, India;

    PSG Coll Arts & Sci, Dept Elect, Coimbatore 641014, Tamil Nadu, India;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
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