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Fatigue crack growth in micro-machined single-crystal silicon

机译:微加工单晶硅的疲劳裂纹扩展

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Although crystalline silicon is not generally considered susceptible to fatigue crack growth, recent studies suggest that there may be fatigue processes in silicon micro-machined structures. In the present study, a micro-machined fracture specimen geometry was used to examine stable crack growth under fatigue loading. Crack length and loads were carefully monitored throughout the test to distinguish between environmentally assisted crack growth (stress corrosion) and mechanically induced fatigue-crack growth. Results revealed similar steplike crack extension versus time for the cyclic and monotonic tests. The fatigue crack-growth curve extracted from the crack extension data exhibited a nearly vertical slope with no evidence of accelerated crack-growth rates. Fracture surfaces for the monotonic and cyclic tests were similar, further suggesting that a true mechanical fatigue crack-growth mechanism did not occur. Explanations for the observed lack of fatigue crack growth are presented and discussed with respect to reported stress-life behavior.
机译:尽管通常不认为晶体硅易于疲劳裂纹扩展,但最近的研究表明,硅微机械结构中可能存在疲劳过程。在本研究中,采用微加工的断裂试样几何形状来检查疲劳载荷下的稳定裂纹扩展。在整个测试过程中,都要仔细监测裂纹的长度和载荷,以区分环境辅助裂纹扩展(应力腐蚀)和机械诱导的疲劳裂纹扩展。结果表明,循环和单调试验的裂纹扩展与时间的相似阶梯状变化。从裂纹扩展数据中提取的疲劳裂纹扩展曲线显示出接近垂直的斜率,没有加速裂纹扩展速率的迹象。单调和循环测试的断裂表面相似,这进一步表明,没有发生真正的机械疲劳裂纹扩展机制。提出并讨论了关于观察到的应力-寿命行为的疲劳裂纹扩展不足的解释。

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