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Electron backscattered diffraction analysis of the effect of deformation temperature on the microstructure evolution in a typical nickel-based superalloy during hot deformation

机译:电子变形散射对典型镍基高温合金热变形过程中变形温度的影响的电子背散射衍射分析

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摘要

The microstructure evolution of a typical nickel-based superalloy was studied in the temperature range of 960-1160 ℃ with the strain rate of 0.001 s~(-1) by using electron backscattered diffraction technique. Based on the grain orientation spread method, the dynamic recrystallization (DRX) grains were distinguished from the deformed grains. The results revealed that the volume fraction and the size of DRX grains increased with the increasing deformation temperatures. Most of the original Σ3 boundaries lost their twin characteristics due to crystal rotations during hot deformation. Meanwhile, lots of new Σ3 boundaries were formed in the DRX grains mainly by growth accidents. Moreover, the deformation temperature had a similar effect on the fraction of Σ3 boundary and the Σ3 boundary density in the DRX domains, which increased firstly and then decreased with the increasing deformation temperature. The Σ3 boundary density was analyzed as a function of grain size, and the critical grain size below which no twin forms was calculated to be 2.06 μm. In addition, the coherent Σ3 boundaries were easier to form at the higher deformation temperature due to their lower boundary energy.
机译:采用电子背散射衍射技术研究了典型的镍基高温合金在960-1160℃温度范围内,应变速率为0.001 s〜(-1)时的组织演变。基于晶粒取向扩散法,将动态再结晶(DRX)晶粒与变形晶粒区分开。结果表明,随着变形温度的升高,DRX晶粒的体积分数和尺寸增加。大多数原始Σ3边界由于热变形过程中的晶体旋转而失去了其孪生特性。同时,DRX晶粒中许多新的Σ3边界是由生长事故形成的。此外,变形温度对DRX域中Σ3边界的分数和Σ3边界密度具有相似的影响,随变形温度的升高先升高后降低。分析了作为晶粒尺寸的函数的Σ3边界密度,计算出没有孪晶的临界晶粒尺寸为2.06μm。另外,由于较低的边界能,相干的Σ3边界在较高的变形温度下更容易形成。

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  • 来源
    《Journal of Materials Research》 |2016年第9期|1348-1360|共13页
  • 作者单位

    College of Mechanical and Electronic Engineering, Shandong University of Science and Technology, Qingdao 266590, People's Republic of China;

    College of Mechanical and Electronic Engineering, Shandong University of Science and Technology, Qingdao 266590, People's Republic of China;

    College of Mechanical and Electronic Engineering, Shandong University of Science and Technology, Qingdao 266590, People's Republic of China;

    School of Materials Science and Engineering, Shandong Jianzhu University, Jinan 250101, People's Republic of China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
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