机译:温度梯度下Cu / Sn / Ni焊点中Cu-Ni交叉相互作用的原位研究
Electronic Packaging Materials Laboratory, School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China;
Electronic Packaging Materials Laboratory, School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China;
Electronic Packaging Materials Laboratory, School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China;
Electronic Packaging Materials Laboratory, School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China;
Electronic Packaging Materials Laboratory, School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China;
Electronic Packaging Materials Laboratory, School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China;
机译:Zn含量对Cu / Sn-xZn / Ni微焊点中Cu-Ni交叉相互作用的影响
机译:Ni_3Sn_4和(Cu,Ni)_6Sn_5金属间化合物层对焊点中Pd和Ni交叉相互作用的影响
机译:Cu / Sn / Pd和Ni / Sn / Pd夹芯焊点结构的交叉相互作用研究
机译:电迁移对线型Cu / Sn / Ni互连中Cu-Ni交叉相互作用的影响
机译:液相扩散键合和用于高温无铅电气连接的Cu-Ni / Sn复合焊膏的开发
机译:Ni对SN-0.7CU焊点SN晶须形成抑制的影响
机译:Ni(Au / Ni / Cu)-SnAg-Cu焊点中的界面反应在回流焊接和热时效过程中的交互作用