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首页> 外文期刊>Journal of Manufacturing Processes >Wireless acquisition of temperature data from embedded thin film sensors in cutting insert
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Wireless acquisition of temperature data from embedded thin film sensors in cutting insert

机译:从切削刀片中的嵌入式薄膜传感器无线获取温度数据

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摘要

This paper presents the results of wireless data acquisition experiments from embedded micro thin film sensors in cutting inserts for machining. A bluetooth module is used to acquire data and establish communication with a receiver PC over the serial port profile (SPP). A signal conditioning circuit is designed and developed to increase the signal-to-noise ratio of the embedded micro thin film sensors. Moreover, an averaging filter algorithm is implemented as a software interface. To characterize the wireless data acquisition (DAQ) system, laser heating and turning tests are conducted. Both tests show that the wireless DAQsystem is able to provide desirable capabilities as well as the wired one for the embedded thin film sensors in cutting inserts.
机译:本文介绍了在加工用切削刀片中嵌入式微薄膜传感器进行无线数据采集实验的结果。蓝牙模块用于通过串行端口配置文件(SPP)来获取数据并建立与接收器PC的通信。设计并开发了一种信号调节电路,以提高嵌入式微薄膜传感器的信噪比。此外,平均滤波器算法被实现为软件接口。为了表征无线数据采集(DAQ)系统,进行了激光加热和车削测试。两项测试均表明,无线DAQ系统能够提供理想的功能,并且能够为切削刀片中的嵌入式薄膜传感器提供有线功能。

著录项

  • 来源
    《Journal of Manufacturing Processes》 |2012年第3期|p.360-365|共6页
  • 作者单位

    Department of Mechanical Engineering, University of Wisconsin-Madison, USA;

    Department of Electrical and Computer Engineering, University of Wisconsin-Madison, USA;

    Department of Mechanical Engineering, Tsinghua University, PR China;

    Department of Mechanical Engineering, University of Wisconsin-Madison, USA;

    Department of Mechanical Engineering, University of Wisconsin-Madison, USA;

    Department of Mechanical Engineering, University of Wisconsin-Madison, USA, 1035 Mechanical Engineering, 1513 University Avenue, Madison, WI 53706-1572, USA;

  • 收录信息
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    wireless data acquisition; embedded micro sensors; machining;

    机译:无线数据采集;嵌入式微传感器;加工;

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