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A Scattering-Mediated Acoustic Mismatch Mode for the Prediction of Thermal Boundary Resistance

机译:散射介导的声失配模式用于热边界电阻的预测

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摘要

Solid-solid thermal boundary resistance (R_b) plays an important role in determining heat flow, both in cryogenic and room-temperature applications, such as very large scale integrated circuitry, superlattices, and superconductors. The acoustic mismatch model (AMM) and the related diffuse mismatch model (DMM) describe the thermal transport at a solid-solid interface below a few Kelvin quite accurately. At moderate cryogenic tem- peratures and above, R_b is dominated by scattering caused by various sources, such as damage in the dielectric substrates and formation of an imperfect boundary layer near the interface, making R_b larger than that predicted by AMM and DMM.
机译:在低温和室温应用(例如超大规模集成电路,超晶格和超导体)中,固-固热边界电阻(R_b)在确定热流方面起着重要作用。声学失配模型(AMM)和相关的扩散失配模型(DMM)非常准确地描述了在几个开尔文以下的固-固界面处的热传递。在适中的低温及以上温度下,R_b受到各种来源引起的散射的支配,例如电介质基板的损坏以及在界面附近形成不完善的边界层,使R_b大于AMM和DMM预测的值。

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