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Modelling of coupled heat and mass transfer during a contact baking process

机译:接触烘焙过程中传热和传质耦合的模型

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摘要

A mathematical model of coupled heat and mass transfer of a contact baking process is developed. In the current model formulation, a local evaporation of water is described with a reaction-diffusion approach, where a simultaneous diffusion and evaporation of water takes place. The resulting coupled model equations (unsteady state heat transfer, liquid water and water vapour) were solved using the Finite Element Method (COMSOL Multi-physics® version 3.5). During the baking process, local temperatures and overall moisture loss were measured continuously. The model - predicting temperature, liquid water content in the product and water in the vapour phase - was calibrated and partially validated using data obtained during baking of a representative food model (a pancake batter) under controlled conditions on a specially designed experimental rig. The unknown parameters in the model equations were estimated using the standard least squares method by comparing the measured with the predicted temperature profile. Good agreement was achieved between model predictions and the experimental values.
机译:建立了接触烘烤过程中传热和传质耦合的数学模型。在当前的模型公式中,通过反应扩散方法描述了水的局部蒸发,其中水同时扩散和蒸发。使用有限元方法(COMSOLMulti-physics®版本3.5)求解所得的耦合模型方程(非稳态传热,液态水和水蒸气)。在烘烤过程中,连续测量局部温度和总水分损失。该模型-预测温度,产品中的液态水含量和气相中的水-已校准,并使用在特殊条件下在特殊设计的试验设备上烘烤代表性食品模型(煎饼糊)期间获得的数据进行了部分校准和验证。通过将测量值与预测温度曲线进行比较,使用标准最小二乘法估算模型方程中的未知参数。在模型预测和实验值之间取得了很好的一致性。

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