Fuji Machine Builds up Product Portfolio to Meet Demands

摘要

The functions covered by surface mount technology (SMT) continues to expand and placement machines are no longer employed exclusively for placing parts onto panels. The need is growing for these machines to support mixed placement, incorporating a semiconductor packaging process. This kind of technical change requires a machine platform that can easily adapt by enabling it to change units to support high level placement techniques. If a machine is built without any allowance to undergo changes using up-gradeable units, a machine with a high level of functionality and can support any requirement must be used. Looking at it from another perspective, the customer must purchase an expensive machine with full specification but does not have the ability to support unforeseen technical developments.