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首页> 外文期刊>Journal of Electronic Testing >Low-Area Wrapper Cell Design for Hierarchical SoC Testing
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Low-Area Wrapper Cell Design for Hierarchical SoC Testing

机译:用于分层SoC测试的低面积封装单元设计

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摘要

System-on-chip (SoC) integrated circuits are designed and fabricated with multiple levels of hierarchy. However, most previous works on wrapper design, test access mechanism optimization and test scheduling did not take care of the hierarchy properly, thus the corresponding test schedules were often invalid for SoCs with hierarchical cores. We propose a low-area wrapper cell design which can treat SoCs with hierarchy properly and allows simultaneous testing of parent and child cores. The proposed cell uses 13%∼23% less area than a recently proposed cell design in equivalent gate count. As a result we achieve up to 21% area reduction for hierarchical ITC ’02 SoCs compared to the most recently proposed designs.
机译:片上系统(SoC)集成电路的设计和制造具有多个层次结构。但是,以前有关包装设计,测试访问机制优化和测试计划的大多数工作都没有适当地照顾到层次结构,因此,相应的测试计划通常对于具有层次结构内核的SoC无效。我们提出了一种低面积封装单元设计,该设计可以正确处理具有层次结构的SoC,并允许同时测试父级和子级内核。提出的单元在等效门数方面比最近提出的单元设计减少13%〜23%的面积。结果,与最新提出的设计相比,分层ITC -02 SoC的面积减少了多达21%。

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