机译:回流过程中水分扩散的直接浓缩方法和全场蒸汽压模型-第一部分:理论和数值实现
Advanced Electronic Manufacturing Center, School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China;
Department of Mechanical Engineering, P. O. Box 10028, Lamar University, Beaumont, TX 77710 Department of Engineering Mechanics, South China University of Technology, Guangzhou 510640, China;
Hong Kong Applied Science and Technology Research Institute, 2 Science Park East Avenue, Shatin, Hong Kong;
Advanced Electronic Manufacturing Center, School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China;
direct concentration approach (DCA); moisture diffusion; vapor pressure; reflow; electronic package; multiscale analysis;
机译:回流过程中水分扩散和全场蒸汽压直接浓缩方法的第二部分:在3D超薄叠层芯片级封装中的应用
机译:精米颗粒中非均质水分扩散的数值模型:扩散系数随水分,温度和时间的变化
机译:单向纤维增强聚合物复合材料中水分扩散的数值模拟
机译:对流扩散模型预测回流焊中堆叠芯片封装的蒸气压
机译:对流扩散模型预测叠片式封装回流焊的蒸气压。
机译:土壤水分对平板水蒸气浓度影响的定量建模
机译:移动源引起的现场效应漂移扩散模型的数值实现方法