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首页> 外文期刊>Journal of Electronic Packaging >Single-Phase and Two-Phase Hybrid Cooling Schemes for High-Heat-Flux Thermal Management of Defense Electronics
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Single-Phase and Two-Phase Hybrid Cooling Schemes for High-Heat-Flux Thermal Management of Defense Electronics

机译:国防电子高通量热管理的单相和两相混合冷却方案

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摘要

This study examines the cooling performance of two hybrid cooling schemes that capitalize on the merits of both microchannel flow and jet impingement to achieve the high cooling fluxes and uniform temperatures demanded by advanced defense electronics. The jets supply HFE 7100 liquid coolant gradually into each microchannel. The cooling performances of two different jet configurations, a series of circular jets and a single slot jet, are examined both numerically and experimentally. The single-phase performances of both configurations are accurately predicted using 3D numerical simulation. Numerical results point to complex interactions between the jets and the microchannel flow, and superior cooling performance is achieved by optimal selection of microchannel height. The two-phase cooling performance of the circular-jet configuration is found superior to that of the slot jet, especially in terms of high-flux heat dissipation. Unprecedented cooling fluxes, as high as 1127 W/cm~(2), are achieved with the circular jets without incurring CHF.
机译:这项研究检查了两种混合冷却方案的冷却性能,这些方案利用了微通道流动和射流冲击的优点来实现先进的国防电子设备所需的高冷却通量和均匀温度。射流逐渐将HFE 7100液体冷却剂供应到每个微通道中。通过数值和实验研究了两种不同的射流配置(一系列的圆形射流和一个单槽式射流)的冷却性能。使用3D数值模拟可以准确预测两种配置的单相性能。数值结果表明,射流与微通道流之间的复杂相互作用,并且通过优化选择微通道高度可以实现出色的冷却性能。发现圆形喷嘴配置的两相冷却性能优于狭缝喷嘴,尤其是在高通量散热方面。使用圆形射流可获得前所未有的高达1127 W / cm〜(2)的冷却通量,而不会产生CHF。

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  • 来源
    《Journal of Electronic Packaging》 |2009年第2期|86-95|共10页
  • 作者

    Myung Ki Sung; Issam Mudawar;

  • 作者单位

    Boiling and Two-Phase Flow Laboratory (BTPFL), Purdue University International Electronic Cooling Alliance (PUIECA), Mechanical Engineering Building, 585 Purdue Mall, West Lafayette, IN 47907-2088;

    Boiling and Two-Phase Flow Laboratory (BTPFL), Purdue University International Electronic Cooling Alliance (PUIECA), Mechanical Engineering Building, 585 Purdue Mall, West Lafayette, IN 47907-2088;

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  • 正文语种 eng
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