机译:同步辐射X射线显微照相技术在倒装芯片互连热疲劳过程的无损评估中的应用
Machinery and Electronics Research Institute, Toyama Industrial Technology Center, 383 Takata, Toyama-shi, Toyama 930-0866, Japan;
Machinery and Electronics Research Institute, Toyama Industrial Technology Center, 383 Takata, Toyama-shi, Toyama 930-0866, Japan;
On-Board Standard Design Department, Cosel Co., Ltd., 1-6-43 Kamiakae-machi, Toyama-shi, Toyama 930-0816, Japan;
On-Board Standard Design Department, Cosel Co., Ltd., 1-6-43 Kamiakae-machi, Toyama-shi, Toyama 930-0816, Japan;
SPring-8, Japan Synchrotron Radiation Research Institute (JASRI), 1-1-1 Koto, Sayo-cho, Sayo-gun, Hyogo 679-5198, Japan;
Department of Mechanical System Engineering, Toyama Prefectural University, 5180 Kurokawa, Imizu-shi, Toyama 939-0398, Japan;
thermal fatigue; life prediction; crack propagation; phase growth; solder joints; flip chip; nondestructive inspection; x-ray microtomography; synchrotron radiation;
机译:同步辐射X射线显微断层扫描无损评估焊球微接头中热相的生长
机译:使用同步辐射X射线原位测量倒装芯片硅片中应变的热和电效应
机译:使用同步辐射X射线原位测量倒装芯片硅模中应变的热和电效应
机译:同步辐射X射线显微照相术在倒装芯片互连中热疲劳损伤的无损评估中的应用
机译:使用同步加速器X射线荧光在热液金刚石砧座中进行原位元素定量分析,并应用于俯冲带过程。
机译:海绵出芽是一个时空形态学过程:从基于同步辐射的X射线显微断层扫描到Tethya wilhelma的无性繁殖的见解
机译:错误的:在使用同步辐射X射线的倒装芯片硅模具中的应变热量和电气效应的原位测量