首页> 外文期刊>Journal of Electronic Packaging >Strain Transfer Analysis of Integrated Surface Acoustic Wave Sensors
【24h】

Strain Transfer Analysis of Integrated Surface Acoustic Wave Sensors

机译:集成表面声波传感器的应变传递分析

获取原文
获取原文并翻译 | 示例
           

摘要

This paper presents a strain transfer investigation for Surface Acoustic Wave (SAW) strain sensors. For evaluation, a SAW strain sensor is assembled with a pretested bond material for potentially high strain transfer on a test holder. The setup is stressed with an axially homogeneous strain up to 500 ppm. The strain transfer ratio is computed from the applied load, the reference measurements with foil strain gauge, and the measured SAW strain sensor signal. The strain transfer performance of the bond material is also investigated with respect to the temperature dependency in the range between 22 ℃ and 85 ℃. At these elevated temperatures an average strain transfer ratio of 0.606 ± 0.7% was measured. Mechanical load cycling tests up to 1000 cycles are used for the evaluation of the elastic fatigue of the bond material. The effects of mechanical load cycling and aging of the bond layer are analyzed with the SAW strain sensor response. After 1000 mechanical load cycles, the transferred strain into the SAW strain sensor is 0.582 ± 0.153%. Finally, the experimental results are compared with the results of a 3D FEM simulation which are deviating by less than 10%.
机译:本文介绍了表面声波(SAW)应变传感器的应变传递研究。为了进行评估,将SAW应变传感器与预先测试的粘结材料组装在一起,以在测试支架上传递潜在的高应变。该装置承受的轴向均匀应变高达500 ppm。应变传递比是由施加的载荷,箔式应变仪的参考测量值和测得的SAW应变传感器信号计算得出的。还针对22℃至85℃之间的温度依赖性研究了粘结材料的应变传递性能。在这些升高的温度下,测得的平均应变传递率为0.606±0.7%。最多可进行1000次循环的机械负载循环测试用于评估粘结材料的弹性疲劳。利用SAW应变传感器响应分析了机械负载循环和粘结层老化的影响。经过1000次机械负载循环后,传递到SAW应变传感器中的应变为0.582±0.153%。最后,将实验结果与3D FEM仿真的结果进行比较,后者的偏差小于10%。

著录项

  • 来源
    《Journal of Electronic Packaging》 |2014年第4期|041002.1-041002.6|共6页
  • 作者单位

    Laboratory for Electrical Instrumentation, Department of Microsystems Engineering, University of Freiburg, Freiburg, Germany;

    Laboratory for Electrical Instrumentation, Department of Microsystems Engineering, University of Freiburg, Freiburg, Germany;

    Laboratory for Assembly and Packaging Technology, Department of Microsystems Engineering, University of Freiburg, Freiburg, Germany;

    Laboratory for Assembly and Packaging Technology, Department of Microsystems Engineering, University of Freiburg, Freiburg, Germany;

    Laboratory for Assembly and Packaging Technology, Department of Microsystems Engineering, University of Freiburg, Freiburg, Germany;

    Laboratory for Electrical Instrumentation, Department of Microsystems Engineering, University of Freiburg, Freiburg, Germany;

  • 收录信息
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号