机译:硅通孔焦耳加热对低功率移动应用中设备性能的影响
Mechanical and Aerospace Engineering, University of Texas at Arlington, 500 W First Street, Woolf Hall Mechanical Engineering, Room 211, Arlington, TX 76019;
Mechanical and Aerospace Engineering, University of Texas at Arlington, 500 W First Street, Woolf Hall Mechanical Engineering, Room 211, Arlington, TX 76019;
Mechanical and Aerospace Engineering, University of Texas at Arlington, 500 W First Street, Engineering Lab Building, Room 203, Arlington, TX 76019;
Mechanical and Aerospace Engineering, University of Texas at Arlington, 500 W First Street, Woolf Hall Mechanical Engineering, Room 211, Arlington, TX 76019;
joule heating; TSVs; e~- mobility; transconductance;
机译:高性能全桥多变频器,具有900 V SIC器件,用于国内感应加热应用
机译:供应链管理的移动设备和应用程序:流程,突发事件和性能影响
机译:计算分流策略的调查,以提高在移动设备上运行的应用程序的性能
机译:TSV焦耳热对器件性能的影响
机译:移动设备的移动代码:迁移以提高应用程序性能。
机译:不对称局部焦耳加热对跨Pt电极介电电泳形成的硅纳米线基器件的影响
机译:在移动设备上增强现实的4D建筑信息建模以支持建筑管理:从利益相关者的角度来看应用程序和关键性能标准