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Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors

机译:硅范德堡应力传感器的四线电桥测量

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摘要

Under the proper orientations and excitations, the transverse output of rotationally symmetric four-contact van der Pauw (VDP) stress sensors depends upon only the in-plane shear stress or the difference of the in-plane normal stresses on (100) silicon. In bridge-mode, each sensor requires only one four-wire measurement and produces an output voltage with a sensitivity that is 3.16 times that of the equivalent resistor rosettes or bridges, just as in the normal VDP sensor mode that requires two separate measurements. Both numerical and experimental results are presented to validate the conjectured behavior of the sensor. Similar results apply to sensors on (111) silicon. The output voltage results provide a simple mathematical expression for the offset voltage in Hall effect devices or the response of pseudo Hall-effect sensors. Bridge operation facilitates use of the VDP structure in embedded stress sensors in integrated circuits.
机译:在适当的方向和激励下,旋转对称的四触点范德堡(VDP)应力传感器的横向输出仅取决于(100)硅上的面内剪切应力或面内法向应力的差异。在桥接模式下,每个传感器只需要进行四线测量即可,其输出电压的灵敏度是等效电阻玫瑰花结或桥接器的3.16倍,就像在普通VDP传感器模式下需要两次单独测量的灵敏度一样。数值和实验结果均被提出来验证传感器的推测行为。类似的结果适用于(111)硅上的传感器。输出电压结果为霍尔效应器件中的失调电压或伪霍尔效应传感器的响应提供了简单的数学表达式。桥接操作有助于在集成电路的嵌入式应力传感器中使用VDP结构。

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