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机译:带有径向通道的大型三维兼容芯片的嵌入式两相冷却
IBM T. J. Watson Research Center, 1101 Kitchawan Road, Yorktown Heights, NY 10598;
IBM T. J. Watson Research Center, 1101 Kitchawan Road, Yorktown Heights, NY 10598;
IBM T. J. Watson Research Center, 1101 Kitchawan Road, Yorktown Heights, NY 10598;
IBM T. J. Watson Research Center, 1101 Kitchawan Road, Yorktown Heights, NY 10598;
IBM T. J. Watson Research Center, 1101 Kitchawan Road, Yorktown Heights, NY 10598;
IBM T. J. Watson Research Center, 1101 Kitchawan Road, Yorktown Heights, NY 10598;
IBM T. J. Watson Research Center, 1101 Kitchawan Road, Yorktown Heights, NY 10598;
IBM T. J. Watson Research Center, 1101 Kitchawan Road, Yorktown Heights, NY 10598;
IBM T. J. Watson Research Center, 1101 Kitchawan Road, Yorktown Heights, NY 10598;
IBM T. J. Watson Research Center, 1101 Kitchawan Road, Yorktown Heights, NY 10598;
机译:功率分布不均匀的电子芯片两相微通道冷却的多孔介质建模
机译:TSV和芯片I / O兼容的3D Ics嵌入式微流体冷却技术
机译:用于单片芯片冷却应用的CMOS兼容微通道散热器的传热和压降实验
机译:带有径向通道的大型3D兼容芯片的嵌入式两相冷却
机译:微型直线和螺旋通道中单相和两相冷却的分析和实验研究。
机译:基于微通道和微引脚芯片的硅与硅直接粘接的微通道和微销翅片的实验研究
机译:三维矩形肋的窄冷却剂通道中水蒸气两相膜流量的数值分析
机译:用于制冷冷却应用的高热通量微通道散热器中的两相流。第1部分:用于直接制冷冷却的微通道散热器;最终的评论。 2007年4月1日至2008年9月30日