机译:用于增强电子热管理的模块化散热器
Department of Mechanical Science and Engineering University of Illinois at Urbana-Champaign 1206 West Green Street Urbana IL 61801;
Department of Mechanical Science and Engineering University of Illinois at Urbana-Champaign 1206 West Green Street Urbana IL 61801;
Department of Electrical and Computer Engineering University of Illinois at Urbana-Champaign 306 North Wright Street Urbana IL 61801;
Department of Mechanical Science and Engineering University of Illinois at Urbana-Champaign 1206 West Green Street Urbana IL 61801;
Department of Electrical Engineering and Computer Sciences University of California Berkeley 253 Corey Hall Berkeley CA 94720;
Department of Mechanical Science and Engineering University of Illinois at Urbana-Champaign 1206 West Green Street Urbana IL 61801 Department of Electrical and Computer Engineering University of Illinois at Urbana-Champaign 306 North Wright Street Urbana IL 61801 Materials Research Laboratory University of Illinois at Urbana-Champaign Urbana IL 61801 International Institute for Carbon Neutral Energy Research (WPI-I2CNER) Kyushu University 744 Moto-oka Nishi-ku Fukuoka 819-0395 Japan;
modular heat sinks; TIM; solder; thermal via; power coverter; GaN; power density; specific power;
机译:微散热器的电子设备热管理和温度均匀性:评论
机译:电子冷却的挑战-增强的热管理技术的机遇微处理器液冷微型通道散热器
机译:电子产品的热管理,使用基于PCM的散热器进行循环热负荷
机译:电子元件热管理中纳米增强相变材料散热器循环熔化与凝固的数值研究
机译:小型散热器的传热增强,用于电子设备冷却
机译:表面微观结构对电子器件中使用散热器散热性能的影响
机译:带有微引脚翅片散热器的GaN功率放大器电子热管理
机译:碳化硅(siC)电力电子和激光棒的热增强:液冷电力电子散热器的统计设计优化。