Comparative Study on Power Module Architectures for Modularity and Scalability

摘要

Silicon carbide (SiC) wide bandgap power electronics are being applied in hybrid electric vehicle (HEV) and electrical vehicles (EV). The Department of Energy (DOE) has set target performance goals for 2025 to promote EV and HEV as a means of carbon emission reduction and long-term s()tinability. Challenges include higher expectations on power density, performance, efficiency, thermal management, compactness, cost, and reliability. This study will benchmark state of the art silicon and SiC technologies. Power modules used in commercial traction inverters are analyzed for their within-package first-level interconnect methods, module architecture, and integration with cooling structure. A few power module package architectures from both industry-adopted standards and proposed patented technologies are compared in modularity and scalability for integration into inverters. The current trends of power module architectures and their integration into inverter are also discussed. The development of an ecosystem to support the wide bandgap semiconductors-based power electronics is highlighted as an ongoing challenge.