The Properties of MOVPE Grown 1.3 μm DFB MQW Lasers Infilled With Semi-Insulating InP Fabricated On Semi-Insulating Substrates

摘要

The use of optoelectronic integrated circuits (OEICs) is now emerging as a practical technology for a variety of applications, particularly in advanced telecommunications. OEICs consist of a range of devices such as lasers, waveguides, modulators, amplifiers, transistors, detectors, etc. fabricated on the same substrate. When a semi-insulating substrate is used, these devices can be electrically isolated by channel etching, resulting in a low capacitance structure with reduced electrical interference between the subcomponents. One of the devices which is particularly advantageous for this type of integration scheme is the distributed feedback (DFB) laser. The laser can be made to function more efficiently by minimizing the current flowing outside the active region. This can be achieved by surrounding the active region with semi-insulating iron doped InP. This work describes for the first time, the MOVPE growth, fabrication, and device characterization of 1.3 μm buried heterostructure DFB MQW lasers, which combine the advantages of using both a semi-insulating substrate and a semi-insulating infill region in the same device structure. The potential advantage of this design scheme is improved OEIC performance as a result of, reduced capacitance and electrical crosstalk, enhanced laser output power, higher speed, increased efficiency, wider operating temperature and reduced threshold current. The laser active region consists of 8 x 140A quantum wells of GaInAsP (λ = 1.3 μm) and 110A barriers of GaInAsP (λ = 1.07μm). Single mode 1.3 μm devices of length 250 μm operating at room temperature produced threshold currents of 8 mA, efficiencies of up to 25%, output powers of 18 mW at 80 mA (pulsed), and a frequency response greater than 12GHz. The parasitic capacitance was estimated to be less than 3 pF.