Microstructural Evolution of a Lead-free Solder Alloy Sn-Bi-Ag-Cu Prepared by Mechanical Alloying During Thermal Shock and Aging

摘要

In a previous study, a lead-free solder, Sn-6Bi-2Ag-0.5Cu, was developed by mechanical alloying. The alloy shows great potential as a lead-free solder system. In the present work, the microstructural evolution during thermal shock and aging was examined.