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首页> 外文期刊>Journal of Electronic Materials >Ti-O Direct-Current-Sintered Bodies and Their Use for Sputter Deposition of TiO Thin Films: Fabrication and Characterization
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Ti-O Direct-Current-Sintered Bodies and Their Use for Sputter Deposition of TiO Thin Films: Fabrication and Characterization

机译:Ti-O直流烧结体及其在TiO薄膜溅射沉积中的应用:制备与表征

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摘要

Ti-50at.%O and Ti-40at.%O sintered bodies were fabricated by direct-current sintering using Ti and TiO2 powders as starting materials. Their microstructures were investigated by x-ray diffraction and optical microscopy. Ti-O thin films were deposited on glass substrates by radiofrequency (RF) magnetron sputtering using a Ti-50at.%O or Ti-40at.%O sintered body as a sputtering target. A crystalline TiO thin film was obtained using a Ti-40at.%O sputtering target, while an amorphous or Ti6O11 thin film was obtained using a Ti-50at.%O sputtering target. The electric resistivity of the TiO thin films was 450 μΩ cm to 1000 μΩ cm depending on their thickness.
机译:以Ti和TiO 2 粉末为原料,通过直流烧结法制备了Ti-50at。%O和Ti-40at。%O烧结体。通过X射线衍射和光学显微镜研究了它们的微观结构。通过使用Ti-50at。%O或Ti-40at。%O烧结体作为溅射靶,通过射频(RF)磁控溅射在玻璃基板上沉积Ti-O薄膜。使用Ti-40at。%O溅射靶获得了结晶TiO薄膜,而使用Ti-50at获得了非晶或Ti 6 O 11 薄膜。 %O溅射靶。 TiO薄膜的电阻率取决于其厚度,为450μΩcm至1000μΩcm。

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